Optimisation of the Conditions for Using Protease and Hemicellulase in Wafer Formulation
Subject Areas : MicrobiologyBabak Ghiassi Tarzi 1 , Venushe Babaei Nami 2 , Parviz Shahbazikhah 3 , Haleh Hadaegh 4
1 - استادیار دانشگاه آزاد اسلامی، واحد علوم و تحقیقات، دانشکده علوم و مهندسی صنایع غذایی
2 - کارشناس ارشد مهندسی صنایع غذایی، دانشگاه آزاد اسلامی، واحد علوم و تحقیقات تهران، ایران
3 - استادیار دانشگاه شهید بهشتی، انستیتو تحقیقات تغذیه و صنایع غذایی، گروه صنایع غذایی، تهران، ایران
4 - دانشجوی دکتری مهندسی صنایع غذایی، دانشگاه آزاد اسلامی، واحد علوم و تحقیقات تهران، ایران
Keywords: Hemicellulase, Optimization, Protease, RSM, Wafer,
Abstract :
Introduction: Economic issues concerned with the demand for energy reduction and costs as well as improved quality of the final product in the bakery industry such as Wafer production is of great importance.Materials and Methods: In the present study the effects of applying different amounts of Protease (0.005-0.05% of the weight of flour), Hemicellulase (0.005-0.05% of the weight of flour), water reduction (0-20%), dough resting time (0-30 min) and the baking time (90-150 sec) on decreasing the waferbatter viscosity and some quality factors of wafer sheet were investigated and compared with the control sample. The amounts of batter viscosity, moisture, crispness and colour of wafer sheet were considered in order to evaluate the effects of various levels of protease and hemicellulas enzymes on the mentioned parameters. Optimisation of the process condition was conducted to determine the optimum formulation for producingwafer sheet.Results: The results were analyzed by Response Surface Methodology (RSM) and showed that optimal level of Protease enzyme, Hemicellulase enzyme, water reduction of formulation, dough resting time and baking time were 0.05%, 0.05%, 9.58%, 30 min and 135.17 sec, respectively.Conclusion: Protease and hemicellulase enzymes might be used in wafer sheet formulation and these enzymes have positive effects on dough and some quality factors of the final product such as moisture and crispiness. According to the variation of the flour quality, the production of wafer will beless dependenton the flour quality.
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