Experimental Study of the Effect of Different Spindle Speeds and Feed Rates in Dry Machining on a Brittle Material
محورهای موضوعی : Machine tools technologyMohammad Reza Safavipour 1 , Masoud Farahnakian 2
1 - Department of Mechanical Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran
2 - Department of Mechanical Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran
کلید واژه: Machining, Feed Rate, Spindle Speed, Rake Angle, Surface Damage,
چکیده مقاله :
Material removal modes in brittle material machining are divided into two categories: ductile modes and brittle modes. Many believe that there is a clear difference between energy costs in these two cases. Spindle speed (SS) and feed rate are the effective parameters in the material machining process. It is tried to conduct experimental studies on the effect of low spindle speeds and high feed rates on the turning of brittle material in this paper. Also, the tool geometry is an important factor in turning brittle materials; so the rake angle of the turning tool was changed for dry machining of a single-crystal workpiece. The results show that the surface roughness decreases by increasing the spindle speed and decreasing the feed rate, which reduces the surface damage significantly. The purpose of this experimental study is to investigate the effect of rotational speed and feed rate on surface roughness and surface texture in the lathe process of the workpiece using the ductile mode of machining and changes in the parameters of this process to control the configuration and dimensions of microstructures (micro craters, Surface pits, and micro-cracks).
[1] Blake, P.N. and Scattergood, R.O. 1990. Ductile-Regime Machining of Germanium and Silicon. Journal of the American Ceramic Society. 73(4): 949-957.
[2] Krauskopf, B. 1984. Diamond turning: reflecting demands for precision. Manufacturing Engineering. 92(5): 90-100.
[3] Shaw, M.C. 1987. Metal Cutting Principles. Oxford University Press, Oxford, NewYork, USA.
[4] Bifano, T.G., Dow, T.A. and Scattergood, R.O. 1991. Ductile-Regime Grinding: A New Technology for Machining Brittle Materials. Journal of Engineering for Industry. ASME, 113(2): 184-189.
[5] Blackley, W.S. and Scattergood, R.O. 1994. Chip topography for ductile-regime machining of germanium. Journal of Engineering for Industry. ASME. 116(2): 263-266.
[6] Morris, J.C., Callahan, D.L., Kulik, J., Patten, J.A. and Scattergood, R.O. 1995. Origins of the Ductile Regime in Single-Point Diamond Turning of Semiconductors. Journal of the American Ceramic Society. 78(8): 2015-2020.
[7] Leung, T.P., Lee, W.B. and Lu, X.M. 1998.Diamond turning of silicon substrates in ductile-regime. Journal of materials processing technology, 73(1-3): 42-48.
[8] Fang, F.Z .1998. Nano-turning of single crystal silicon. Journal of Materials Processing Technology, 82(1-3): 95-101.
[9] Fang, F.Z. and Venkatesh, V.C. 1998. Diamond cutting of silicon with nanometric finish. CIRP Annals-Manufacturing Technology. 47(1): 45-49.
[10] Zhong, Z.W. 2003. Ductile or partial ductile mode machining of brittle materials. The International Journal of Advanced Manufacturing Technology. 21(8): 579-585.
[11] Yan, J., Maekawa, K., Tamaki, J.I. and Kuriyagawa, T. 2005. Micro grooving on single-crystal germanium for infrared Fresnel lenses. Journal of micromechanics and micro engineering. 15(10): 1925-1931.
[12] Yan, J., Takahashi, Y., TAMAKI, J.I., Kubo, A., Kuriyagawa, T. and Sato, Y. 2006. Ultra-precision machining characteristics of poly-crystalline germanium. JSME International Journal Series C Mechanical Systems, Machine Elements and Manufacturing, 49(1): 63-69.
[13] Cai, M.B., Li, X.P. and Rahman, M. 2007.Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon. Journal of manufacturing science and engineering. ASME, 129(2): 281-286.
[14] Özel, T., Hsu, T. K., Zeren and E. 2005. Effects of cutting edge geometry, workpiece hardness, feed rate and cutting speed on surface roughness and forces in finish turning of hardened AISI H13 steel. The International Journal of Advanced Manufacturing Technology. 25(3): 262-269.
[15] Tanaka, H., Shimada, S. and Anthony, L. 2007. Requirements for ductile-mode machining based on deformation analysis of mono-crystalline silicon by molecular dynamics simulation. CIRP annals. 56(1): 53-56.
[16] Pawase, P., Brahmankar, P.K., Pawade, R.S. and Balasubramanium, R. 2014. Analysis of machining mechanism in diamond turning of germanium lenses. Procedia Materials Science. 5: 2363-2368.
[17] Kovalchenko, A.M., Milman, Y.V. 2014. On the cracks self-healing mechanism at ductile mode cutting of silicon. Tribology International. 80: 166-171.
[18] Zhang, S.J., Suet To, S., Wang, S.J. and Zhu, Z.W. 2015. A review of surface roughness generation in ultra-precision machining. International Journal of Machine Tools and Manufacture. 91: 76-95.
[19] Gupta, S., Khatri, N., Karar, V. and Dhami, S.S. 2016. Investigation of Surface Roughness of Single Point Diamond Turned Germanium Substrate by Coherence Correlation Interferometry and Image Processing. In IOP Conference Series: Materials Science and Engineering. 149(1): 012032.
[20] Bai, J., Bai, Q., Chao, Hu., Xin, He. and Pei, X. 2018. Research on the ductile-mode machining of monocrystalline silicon using polycrystalline diamond (PCD) tools. The International Journal of Advanced Manufacturing Technology. Springer. 94(5): 1981-1989.
[21] Xu, F., Fang, F. and Zhang, X. 2018. Effects of recovery and side flow on surface generation in nano-cutting of single crystal silicon. Computational Materials Science. 143: 133-142.
[22] Safavipour, M., Farahnakian, M. 2021. Experimental study of Germanium dry machining with various Rake angles and different Feed rates of Tool. Journal of Modern Processes in Manufacturing and Production. 10(1): 63-76.