A Comparative Overview of Electronic Devices Reliability Prediction Methods-Applications and Trends

Subject Areas : Majlesi Journal of Telecommunication Devices

Frederick  Ehiagwina ¹ (Federal Polytechnic, Offa)
Titus  Adewunmi ² (Federal Polytechnic, Offa)
Emmanuel  Seluwa ³ (Federal Polytechnic, Offa)
Olufemi  Kehinde ⁴ (Federal Polytechnic, Offa)
Nafiu  Abubakar ⁵ (Federal Polytechnic, Offa)

Received: 2016-05-07 Accepted : 2017-01-01 Published : 2016-01-01

Keywords:

References:

[1] EPSMA, “Guidelines to Understanding Reliability Predictions”, EPSMA, 2005.

[2] B. Foucher, J. Boullie, B. Meslet and D. Das, "A Review of Reliability Prediction Methods for Electronic devices," Microelectronics Reliability, vol. 42, no. 8, pp. 1155-1162, August 2002.

[3] Reliasoft, (2014) Reliability Prediction Methods. [Online]. Available: http://www.reliasoft.com/newsletter/v9i1/prediction_methods.html. [Accessed 02 August 2014].

[4] R. Burgos, G. Chen, F. Wang, D. Boroyevich, W. Odendaal and J. van Wyk, "Reliability-oriented design of three-phase power converters for aircraft applications," Aerospace And Electronic Systems, IEEE Transactions on, vol. 43, no. 2, pp. 1249-1263, 12 April 2012.

[5] H.-D. Kochs, P. Kongniratsaikul and F. Lutz, "Comparing system reliability considering insufficient knowledge: Application to HVDC converter stations," in Power and Energy Society General Meeting, 2012 IEEE, 2012.

[6] H. Mou, W. Hu, Y. Sun and G. Zhao, "A comparison and case studies of electronic product reliability prediction methods based on handbooks," in Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on, 2013.

[7] B. Abdi and L. Yazdanparast, "Experimental reliability estimation of MPPT converter's in different operating modes," in Computer Science and Engineering Conference (ICSEC), 2014 International, 2014.

[8] K. Choudhary and P. Sidharthan, "Reliability prediction of Electronic Power Conditioner (EPC) using MIL-HDBK-217 based parts count method," in Computer, Communication and Control (IC4), 2015 International Conference on, 2015.

[9] J. Dudek, R. Hrbac, T. Krenzelok and V. Brezovsky, "Point estimate of failure intensity and operational availability of electronic signaling railway equipment," in Electric Power Engineering (EPE), 2015 16th International Scientific Conference on, 2015.

[10] F. Obeidat and R. Shuttleworth, "Reliability prediction of PV inverters based on MIL-HDBK-217F N2," in Photovoltaic Specialist Conference (PVSC), 2015 IEEE 42nd, 2015.

[11] MIL-HDBK-217F, Reliability prediction of electronic equipment, Notice 1 (1992) and Notice 2 (1995), US Military, 1991.

[12] F. O. Ehiagwina, O. T. Adewunmi, O. O. Bamigboye and E. O. Seluwa, "Determination of the reliability of a locally made clap activated switch by part count analysis," International Journal of Engineering and Applied Science, vol. 5, no. 1, pp. 62-71, February 2016.

[13] Telcordia, reliability prediction procedure for electronic equipment, Issue 1, Telecordia, 2001.

[14] Telecordia, reliability prediction procedure for electronic equipment, Issue 2, Telecordia, 2006.

[15] L. Zhou, R. Cao, C. Qi and R. Shi, "Reliability prediction for smart meter based on Bellcore standards," in Quality, Reliability, Risk, Maintenance, and Safety Engineering (ICQR2MSE), 2012 International Conference on, 2012.

[16] J. Kim, S. Choi, K. Lee and K. Lee, "Reliability prediction approach of dc-dc converter with electrical stress analysis," in Integrated Power Systems (CIPS), 2014 8th International Conference on, 2014.

[17] L. Bechou, Y. Deshayes, Y. Ousten, O. Gilard, G. Quadri and L. How, "Monte-Carlo computations for predicted degradation of photonic devices in space environment," in Aerospace Conference, 2015 IEEE, 2015.

[18] ITEM Software and Reliasoft Corporation, RS 490 Course Notes: Introduction to standards based reliability prediction and lambda predict, 2006.

[19] D. Hirschmann, D. Tissen, S. Schroder and R. De Doncker, "Reliability prediction for inverters in hybrid electrical vehicles," Power Electronics, IEEE Transactions on, vol. 22, no. 6, pp. 2511-2517, November 2007.

[20] R. German, A. Sari, P. Venet, Y. Zitouni, O. Briat and J.-M. Vinassa, "Ageing law for supercapacitors floating ageing," in Industrial Electronics (ISIE), 2014 IEEE 23rd International Symposium on, 2014.

[21] M. Musallam, C. Yin, C. Bailey and M. Johnson, "Mission profile-based reliability design and real-time life consumption estimation in power electronics," Power Electronics, IEEE Transactions on, vol. 30, no. 5, pp. 2601-2613, 1 May 2015.

[22] D. Fan, Y. Ren, Z. Wang and L. Liu, "Mission reliability prediction methods for board-level electronic equipment based on physics of failure and Bayesian networks," in Reliability Systems Engineering (ICRSE), 2015 First International Conference on, 2015.

[23] K. Hausler, B. Sumpf, G. Erbert and G. Trankle, "Degradation analysis of 808 nm GaAsP laser diodes," in Lasers and Electro-Optics - Pacific Rim, 2007. CLEO/Pacific Rim 2007. Conference on, 2007.

[24] Y. Ren, Q. Feng, T. Ye and B. Sun, "A novel model of reliability assessment for circular electrical connectors,"Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 6, no. 5, pp. 755-761, 2015.

[25] A. Kerber, W. McMahon and E. Cartier, "Voltage ramp stress for hot-carrier screening of scaled CMOS devices," Electron Device Letters, IEEE, vol. 30, no. 6, pp. 749-751, April 2012.

[26] A. Zaka, P. Palestri, Q. Rafhay, R. Clerc, M. Iellina, D. Rideau, C. Tavernier, G. Pananakakis, H. Jaouen and L. Selmi, "An efficient nonlocal hot electron model accounting for electron: electron scattering," Electron Devices, IEEE Transactions on, vol. 59, no. 4, pp. 983-993, April 2012.

[27] F. Zarate-Rincon, D. Garcia-Garcia, V. Vega-Gonzalez, R. Torres-Torres and R. Murphy-Arteaga, "Characterization of hot-carrier-induced rf-mosfet degradation at different bulk biasing conditions from parameters," Microwave Theory and Techniques, IEEE Transactions on, vol. 65, no. 1, pp. 125-132, 2016.

[28] W. Li and C. M. Tan, "Black's equation for today's ULSI interconnect Electromigration reliability: A revisit," in Electron Devices and Solid-State Circuits (EDSSC), 2011 International Conference of, 2011.

[29] R. Labie, T. Webers, C. Winters, V. Cherman, K. Croes, B. Vandevelde and F. Dosseul, "Electromigration failure mechanisms for different flip chip bump configurations," in Reliability Physics Symposium (IRPS), 2011 IEEE International, 2011.

[30] R. De Orio and S. Selberherr, "Physically based models of electromigration," in Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of, 2013.

[31] D. G. Zeng, K.-i. Lee, K.-w. Chung and S. Bae, "Electromigration in giant magnetoresistance spin valve read sensors under pulsed dc magnetic field: an analytical and numerical study," Magnetics, IEEE Transactions on, vol. 49, no. 2, pp. 845-850, February 2013.

[32] X. Huang, Y. Tan, V. Sukharev and S.-D. Tan, "Physics-based electromigration assessment for power grid networks," in in Design Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE, 2014.

[33] Y. Xu, L. Huang, G. Chen, F. Wu, W. Xia and H. Liu, "Electromigration — induced failure mechanism and lifetime prediction in NiCu thin film," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on, 2014.

[34] M. Rovitto, W. Zisser and H. Ceric, "Analysis of electromigration void nucleation failure time in open copper TSVs," in Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the, 2015.

[35] A. Testa, S. De Caro and S. Russo, "A reliability model for power MOSFETs working in avalanche mode based on an experimental temperature distribution analysis," Power Electronics, IEEE Transactions, vol. 27, no. 6, pp. 3093-3100, June 2011.

[36] C. Junhua, Z. Jiping, S. Yan and Z. Lixin, "Fatigue life predicting of lead-free soldered joints of QFP device," in in Computer Science & Service System (CSSS), 2012 International Conference on, 2012.

Computer Science & Service System (CSSS), 2012 International Conference on, 2012.

[37] M. A. Neidigk and S. Yu-Lin, "Predicting the effect of underfill filler volume fraction on solder fatigue life and residual stress for surface mount components using nonlinear viscoelastic analyses," Components, Packaging and Manufacturing Technology, IEEE Transactions on, vol. 2, no. 9, pp. 1492-1500, September 2012.

[38] H.-C. Cheng, Y.-M. Tsai, S.-T. Lu and W.-H. Chen, "Interconnect reliability characterization of high-density 3-d chip-on-chip interconnect technology," Components, Packaging and Manufacturing Technology, IEEE Transaction on, vol. 3, no. 12, pp. pp. 2037-2047, 11 December 2013.

[39] T. Happonen, T. Ritvonen, P. Korhonen, J. Hakkinen and T. Fabritius, "Modeling the lifetime of printed silver conductors in cyclic bending with the coffin-manson relation," Device and Materials Reliability, IEEE Transactions on, vol. PP, no. 99, p. 1, 2015.

[40] B. Zhang and G. Tao, "An improved coffin-manson model for mid-power led wire-bonding reliabilty," in Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the, Marina Bay Sands, 2014.

[41] J.-S. Huang, "Reliability-extrapolation methodology of semiconductor laser diodes: is a quick life test feasible?," Device and Materials Reliability, IEEE Transactions on, vol. 6, no. 1, pp. 46-51, 1 March 2006.

[42] L. Han and N. Narendran, "An accelerated test method for predicting the useful life of an led driver," Power Electronics, IEEE Transactions on, vol. 26, no. 8, pp. 2249-2257, August 2011.

[43] W. Denson, "The history of reliability prediction," IEEE Transactions on Reliability, vol. 42, no. 3-SP, September 1998.

[44] T. Adithya, K. V. Ajit and K. Uday, "Comparison of failure characteristics of different electronic technologies by using modified physics-of-failure approach," International Journal of System Assurance Engineering and Management,

vol. 6, no. 2, pp. 198-205, 2015.