An Investigation on the effect of adding copper sulfate on the properties and corrosion resistance of electroless nickel-phosphorus coating

Subject Areas : journal of New Materials

A. Farshoud ¹ , K. Amini ² , A.H. Emami ³

1 - کارشناس ارشد ،مرکز تحقیقات مواد پیشرفته، دانشکده مهندسی مواد، واحد نجف آباد، دانشگاه آزاد اسلامی، نجف آباد، ایران
2 - دانشیار، دانشکده مکانیک، واحد تیران، دانشگاه آزاداسلامی، تیران ،ایران 2-دانشیار، مرکز تحقیقات مواد پیشرفته، دانشکده مهندسی مواد، واحد نجف آباد، دانشگاه آزاد اسلامی، نجف آباد، ایران
3 - استادیار ، مرکز تحقیقات مواد پیشرفته، دانشکده مهندسی مواد، واحد نجف آباد، دانشگاه آزاد اسلامی، نجف آباد، ایران

Received: 2016-08-21 Accepted : 2016-08-21 Published : 2016-07-22

Keywords: Corrosion, Microstructure, morphology, Electroless nickel-phosphorus, Copper sulfate,

Abstract :

       In this study, the effects of adding copper sulfate on the properties and corrosion resistance of electroless coating of nickel - phosphorus on aluminum substrates has been investigated. Samples after surface preparation were coated with adding different concentrations of copper sulfate (0.2 to 1 gram per liter) in nickel-phosphorus electroless baths. To examine the coating structure changes with different concentrations of copper sulfate, X-ray diffraction(XRD) was used. In order to evaluate the morphology of the surface , the optical microscope was used and to study the chemical composition and cross-section, the scanning electron microscope equipped with EDS analyzer was used. Vickers hardness was measured using the micro-scale. The corrosion resistance studies were carried out using Tafel polarization test in a solution of % 3/5 NaCl. Test results showed that increasing the amount of copper sulfate in electroless nickel-phosphorus plating bath increases the bath stability and reduce the deposition rate, morphology changes and crystallization of coverage and significant reduction in hardnes were resulted.also corrosion resistance of Electroless nickel-phosphorus coating significantly increased In the presence of copper , due to Reduce porosity and the passire state which was resulted.

References:

 

1- W. Riedel, Electroless Nickel Plating, ASM International, Ohio, 1991.

2- R.C. Agarwala, and V. Agarwala, "Electroless alloy/composite coatings: A review", Sadhana, Vol. 28 (3-4), pp. 475-493, 2003.

3- S. Ranganatha , T. Venkatesha, and K. Vathsala, "Development of electroless Ni–Zn–P/nano-TiO2 composite coatings and their properties", Applied Surface Science,Vol. 256(24), pp. 7377-7383, 2010.

4- M. Novak, D. Vojtech, and T. Vitu, "Influence of heat treatment on tribological properties of electroless Ni–P and Ni–P–Al2O3 coatings on Al–Si casting alloy", Applied Surface Science, Vol. 256(9), pp. 2956-2960,2010.

5- G.O. Mallory and J.B. Hajdu, Electroless Plating-Fundamentals and Applications, reprint ed. AESF, New York, 2002.

6- J.N. Balaraju, V. EzhilSelvi, V.K. William Grips and K.S. Raja, “Electrochemical studies

 

on electroless ternary an quaternary Ni–P based alloys”, Electrochim. Acta, Vol. 52, pp. 1064–1074, 2006.

7- G. Jiaqiang, W. Yating, L. Lei, S. Bin and H. Wenbin, “Crystallization temperature of amorphous electroless nickel–phosphorus alloys”, Materials Letters, Vol. 59, pp.1665–1669, 2005.

8- R. Weil and K. Parker, “Electroless plating: Fundamentals and applications”, (ed. G. Mallory et al.), Vol. 1110 AESF, 1990.

9-Y. Huang, K. Shi, Z. Liao, Y. Wang, L. Wang and F. Zhu, "Studies of electroless Ni–Co–P ternary alloy on glass fibers", Materials letters, Vol. 61(8), pp.1742-1746, 2007.

10-V. K. Bulasara, Ch. S. N. Mahesh Babu and R. Uppaluri, "Effect of surfactants on the performance of electroless plating baths for nickel-ceramic composite membrane fabrication", Surface Engineering, Vol. 28, pp. 44-48, 2012.

11- B. H. Chen, L. Hong, Y. Ma and T. M. Ko, "Effect of Surfactants in an Electroless Nickel Plating Bath on the Properties of Ni-P Alloy Deposits", Industrial and Engineering Chemistry Research, Vol. 41, pp. 2668-2678, 2002.

12- H. G. Ying, M. Yan, T. Y. Ma and L. Q. Yu, " Effects of NH4F on the deposition rate and buffering capability of electroless Ni–P plating solution ", Surface and Coatings Technology, Vol. 202, pp. 217-221, 2007.

13- M. Yan, H. G. Ying, T. Y. Ma and W. Luo, "Effects of Yb3+ on the corrosion resistance and deposition rate of electroless Ni–P deposits ", Applied Surface Science, Vol. 255, pp. 2176-2179, 2008.

14 - م.تاج بخش و م. فرهادی نیا ، " بررسی تاثیر مواد پایدارکننده و فعال‌کننده سطحی بر مورفولوژی و سختی پوشش کامپوزیتی الکترولس Ni-P/nano TiO2 " فصلنامه علمی-پژوهشی مواد نوین ، دوره 5 ، شماره 19 ، صفحه 9-22 ، بهار 1394.

15‌‌- م.تاج بخش و م. فرهادی نیا ، " ایجاد پوشش کامپوزیتی Ni-P/nanoPTFE به روش الکترولس و بررسی خواص آن " فصلنامه علمی-پژوهشی مواد نوین ، دوره 6 ، شماره 21 ، صفحه 61-72 ، پاییز 1394.

16- P. Atkins and J. Paula: ‘Physical Chemistry’, 8th ed., NewYork, Oxford University Press, 2006.

17- Z. Xie, G. Yu, B. Hu, X. Lei, T. Li and J. Zhang, " Effects of (NH4)2SO4 on the characteristics of the deposits and properties of an electroless Ni–P plating solution", Applied Surface Science, Vol. 257, pp. 5025-5031, 2011.

18- S. Armyanov, J. Georgieva and D. Tachev, Electroless of Ni–Cu–P alloys in acidicsolutions, Electrochem. Solid State Lett, Vol. 2, pp.323–325, 1999.

19- K.G. Keong, W.  Sha, and S. Malinov, “Hardness Evolution of Electroless Nickel-Phosphorus Deposits with Thermal Processing”, Surface and Coatings Technology, Vol. 168, No. 2-3, pp. 263-274, 2003.

20- J.N. Balaraju and K.S. Rajam, Electroless deposition of Ni–Cu–P, Ni–W–P and Ni–W–Cu–P alloys, Surf. Coat. Technol, Vol. 195,pp 154–161, 2005

21- J. Liua and X. Wanga, “Effect of copper content on the properties of electroless Ni–Cu–Pcoatings prepared on magnesium alloys”, Surface Science, Vol. 356, pp 289–293 , 2015

22- W.J. Tomlinson and J.P. Mayor, “Formation, Microstructure, Surface Roughness, and Porosity of Electroless Nickel Coatings”, Surface Engineering, Vol. 4(3), pp. 235, 1988.

23- L.L. Zhong and C.C. Liu, “Electroless nickel–phosphorous coatings with highthermal stability”, US Patent 6410104 ,June 25, 2002.

24- T. C. Wen and M. G. Wei, "Electrocrystallization of PbO2 deposits in the presence of additives", Journal of Electrochemical Society, Vol. 137, pp. 2700-2702, 1990.

25- H. Ashassi-Sorkhabi, and S.H. Rafizadeh, "Effect of coating time and heat treatment on structures and corrosion characteristics of electroless Ni–P alloy deposits", Surface and Coatings Technology, Vol. 176(3) , pp. 318-326, 2004.

26- J. Flis, and D. Duquette, "Effect of phosphorus on anodic dissolution and passivation of nickel in near-neutral solutions", Corrosion, Vol. 41(12), pp. 700-706, 1985.

27- G.C. Liu, L.J. Yang, L. Wang, S.L. Wang, C.Y. Liu and J. Wang, “Corrosion behavior ofelectroless deposited Ni–Cu–P coating in flue gas condensate”, Surf. Coat.Technol. Vol. 204 , pp. 3382–3386. 2010

28- M. Cisse, M. Abouchane, T. Anik, K. Himm, R.A. Belakhmima, M.E. Touhami, R.Touir and A. Amiar, “Corrosion resistance of electroless Ni–Cu–P ternary alloycoatings in acidic and neutral corrosive mediums” , Int. J. Corrosion, pp. 1–9, 2010.

29- A. Fattah-alhosseini; B. Izadi and M. Asadi Asadabad , “Evaluation of corrosion behaviour on Mn-Cr austenitic steels using 0.1 M HCl solution” Journal of Advanced Materials and Processing , Vol. 2(2), pp. 21-30, Spring 2014.

30- A. chami and B. Nasiri-Tabrizi, “Effect of heating rate on morphological features of oxidized electrolessnickel–boron coatings” Journal of Advanced Materials and Processing, Vol. 3(3), pp 61-70, Summer 2015.