Stress Analysis of Adhesively-Bonded Single-Lap Joints Based on a Three-Parameter Viscoelastic Foundation Model
Subject Areas : Journal of New Applied and Computational Findings in Mechanical Systemsmehdi veisytabar 1 , Arash Reza 2 , Younes Shekari 3
1 - aDepartment of Mechanical Engineering, Ahvaz Branch, Islamic Azad University, Ahvaz, Iran;
2 - Department of Mechanical Engineering, Ahvaz Branch, Islamic Azad University, Ahvaz, Iran
3 - Mechanical Engineering Department, Yasouj University, Yasouj, Iran
Keywords: Adhesively bonded single lap joint, Three-parameter viscoelastic foundation model, peel stress, Numerical inverse Laplace Gaver-Stehfes method. ,
Abstract :
In this study evaluated stress distribution at the adhesively-bonded single-lap joints under tensile loading with isotropic adherends using a three-parameter viscoelastic foundation model. In this model, assumed shear stress is constant and peel stress is different along thickness of adhesive layer. In this study, the adhesive layer is modeled as a three-parameter viscoelastic foundation using the Zener model and the governing differential equations are derived using equilibrium equations and constitutive equations in Laplace’s domain. Then simultaneously solving them, the Gaver-Stehfest inverse Laplace transform method is used to obtain the equations in the time domain. At the end, results obtained of this model compare with the results of finite element that there are good agreement between them. Maximum reduction of shear stress occurs at 0.5mm last end of the overlap of Brass adherend and Maximum reduction of Pell stress occurs at 0.5mm last end of the overlap of Aluminum adherend. Reduction of stress with pass time after about 11 days near to zero and it stable.
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