Experimental Study of Germanium Dry Machining with Various Rake Angles and Different Feed Rates of Tool
الموضوعات :
Mohammad Reza Safavipour
1
(
Department of Mechanical Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran
)
Masoud Farahnakian
2
(
Department of Mechanical Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran
)
الکلمات المفتاحية: Surface Roughness, Machining, Germanium, Feed Rate, Rake Angle, Surface Damage,
ملخص المقالة :
Today, germanium single-crystals are used as an infrared and semiconductor material in the manufacturing of infrared optical lenses and windows (thermal vision), gamma-ray detectors, and substrates for optoelectronic and electronic applications. Given that germanium is an optically brittle material with high brittleness and brittle failure that mainly affects the surface integrity of the machined part on this material; In this experimental study, by changing the rake angle and feed rate of the cutting tool, experiments were performed to determine the appropriate rake angles and suitable feed rates and their effects on the surface roughness and texture of the relevant surface for germanium turning in the dry state. The results show that with increasing the rake angle and decreasing the feed rate of the cutting tool, the surface roughness decreases, which reduces the surface damage to a considerable extent. The purpose of this experimental study is to create a surface with the desired quality in the machining process of the germanium optical part using ductile mode machining and to change the parameters of this process to control the configuration and dimensions of microstructures, micro-cracks, micro craters, and Surface pits.
[1] Claeys, C. and Simoen, E. 2011. Germanium-based technologies: from materials to devices. Chapter 1: Germanium Materials. Elsevier, 11-40.
[2] Derluyn, J., Dessein, K., Flamand, G., Mols, Y. Poortmans, J. Borghs, G. and Moerman, I. 2003. Comparison of MOVPE grown GaAs solar cells using different substrates and group-V precursors. Journal of Crystal Growth. 247(3-4): 237-244.
[3] Blake, P.N. and Scattergood, R.O. 1990. Ductile-Regime Machining of Germanium and Silicon. Journal of the American Ceramic Society. 73(4): 949-957.
[4] Krauskopf, B. 1984. Diamond turning: reflecting demands for precision. Manufacturing Engineering. 92(5): 90-100.
[5] Shaw, M.C. 1987. Metal Cutting Principles. Oxford University Press, Oxford, NewYork, USA.
[6] Bifano, T.G., Dow, T.A. and Scattergood, R.O. 1991. Ductile-Regime Grinding: A New Technology for Machining Brittle Materials. Journal of Engineering for Industry. 113(2): 184-189.
[7] Blackley, W.S. and Scattergood, R.O. 1991. Ductile regime model for diamond turning of brittle materials. Precision Engineering. 13(2): 95–103.
[8] Blackley, W.S. and Scattergood, R.O. 1994. Chip topography for ductile-regime machining of germanium. Journal of Engineering for Industry. ASME, 116(2): 263-266.
[9] Morris, J.C., Callahan, D.L., Kulik, J., Patten, J.A. and Scattergood, R.O. 1995. Origins of the Ductile Regime in Single-Point Diamond Turning of Semiconductors. Journal of the American Ceramic Society, 78(8): 2015-2020.
[10] Leung, T.P., Lee, W.B. and Lu, X.M. 1998. Diamond turning of silicon substrates in ductile-regime. Journal of materials processing technology. 73(1-3): 42-48.
[11] Fang, F.Z. and Zhang, G.X. 2004. An experimental study of optical glass machining. International Journal of Manufacturing Technology. 23(3-4): 155-160.
[12] Özel, T., Hsu, T.K. and Zeren, E. 2005. Effects of cutting edge geometry, workpiece hardness, feed rate and cutting speed on surface roughness and forces in finish turning of hardened AISI H13 steel. The International Journal of Advanced Manufacturing Technology. 25(3): 262-269.
[13] Yan, J., Takahashi, Y., Tamaki, J.I., Kubo, A., Kuriyagawa, T. and Sato, Y. 2006. Ultra-precision machining characteristics of poly-crystalline germanium. JSME International Journal Series C Mechanical Systems, Machine Elements and Manufacturing, 49(1): 63-69.
[14] Stephenson, D. A. and Agapiou, J. S. 2006. Metal Cutting Theory and Practice. 2nd ed., CRC Press, Taylor and Francis Group, Florida, USA.
[15] Arefin, S., Li, X. P., Rahman, M., and Liu, K. 2007. The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer. The International Journal of Advanced Manufacturing Technology. 31(7-8): 655-662.
[16] Pawase, P., Brahmankar, P.K., Pawade, R.S. and Balasubramanium, R. 2014. Analysis of machining mechanism in diamond turning of germanium lenses. Procedia Materials Science. Elsevier, 5: 2363-2368.
[17] Kovalchenko, A.M. and Milman, Y.V. 2014. On the cracks self-healing mechanism at ductile mode cutting of silicon. Tribology International. 80: 166-171.
[18] Zhang, S.J., To, S., Wang, S.J. and Zhu, Z.W. 2015. A review of surface roughness generation in ultra-precision machining. International Journal of Machine Tools and Manufacture. 91: 76-95.
[19] Farahnakian, M., Keshavarz, M.E., Elhami, S. and Razfar, M.R. 2016. Effect of cutting edge modification on the tool flank wear in ultrasonically assisted turning of hardened steel. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture. 233(5): 1472-1482.
[20] Gupta, S., Khatri, N., Karar, V. and Dhami, S.S. 2016. Investigation of Surface Roughness of Single Point Diamond Turned Germanium Substrate by Coherence Correlation Interferometry and Image Processing. IOP Conference Series: Materials Science and Engineering. 149(1): 012032.
[21] Huang, P. and Lee, W.B. 2016. Cutting force prediction for ultra-precision diamond turning by considering the effect of tool edge radius. International Journal of Machine Tools and Manufacture. 109: 1-19.
[22] Bai, J., Bai, Q., Chao, Hu., Xin, H. and Pei, X. 2018. Research on the ductile-mode machining of monocrystalline silicon using polycrystalline diamond (PCD) tools. The International Journal of Advanced Manufacturing Technology. 94(5-8): 1981-1989.
