Age-Hardening Behavior and the Related Changes in a Silver-Copper-Palladium Alloy

الموضوعات :

Morteza Hadi ¹ , Iman Ebrahimzadeh ² , Omid Bayat ³

1 - Metallurgy and Materials Engineering Department, Golpayegan University of Technology, Golpayegan, Iran
2 - Advanced Materials Research Center, Department of Materials Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran
3 - Department of Materials science and Engineering, Hamedan University of Technology, Hamedan, Iran

تاريخ الإرسال : 18 الخميس , صفر, 1441 تاريخ التأكيد : 18 الأحد , ربيع الثاني, 1441 تاريخ الإصدار : 08 الجمعة , رمضان, 1441

الکلمات المفتاحية: X-ray diffraction, Scanning Electron Microscopy, Age-hardening, Ag-Cu-Pd alloys,

ملخص المقالة :

Age-hardening behavior and related changes were studied to elucidate the hardening mechanism of an Ag–Cu–Pd alloyby Differential Scanning Calorimetry (DSC), hardness test, X-ray diffraction (XRD), scanning electron microscopic (SEM) observations and energy dispersive spectrometer (EDS). The results showed that hardness of the alloy was raised to 90% and 68% of its solution state value by isothermal aging at 300 ◦C and 400 ◦C, respectively. However, aging at 500 ◦C led to a decrease in the hardness of the alloy. Moreover, while age hardening at 300◦C occurred due to coherency strains between the (111) plane of Ag-rich and the (111) plane of Cu3Pd phases, the mechanism of aging at 400◦C was the formation ofCu3Pd superlattice with the L12-type crystal structure. In contrast, reduction of Cu3Pd phase and formation of Cu solid solution decreased hardness during aging at 500oC.

المصادر:

[1] J. Lin, L. Meng, “Effect of aging treatment on microstructure and mechanical properties of Cu–Ag alloys”, J. Alloy and compd., Vol. 454, 2008, pp. 150–155.

[2] M.C. Vera, J. Martinez-Fernandez, M. Singh, V. Casalegno, C. Balagna, and J. Ramirez-Rico, “Microstructure and thermal conductivity of Si-Al-CO fiber bonded ceramics joined to refractory metals”, Materials Letters, Vol. 276, 2020, pp 128203.

 [3] J. Hu, M. Xie, Y. Chen, J. Fang, and Y. Yang, “Structure, energy and electronic properties of Ag/Cu/M (M= Ni, Pd) interfaces: A first principles study”, Computational Materials Science, Vol. 169, 2019, pp 109-133.

 [4] Venkateswaran, T., Xavier, V., Sivakumar, D., Pant, B., Jayan, P.K. and Ram, G.J., 2019. Brazing of Martensitic Stainless Steel to Copper Using Electroplated Copper and Silver Coatings. Journal of Materials Engineering and Performance, 28(2), pp.1190-1200.

 [5] H. Kim, K.H. Baik, J. Cho, et al., “High-reflectance and thermally stable Ag-Cu alloy p-Type reflectors for GaN-based light-emitting diodes”, IEEE Photonics Tech. L., Vol. 19, 2007, pp. 336-338.

[6] J. Zhang, M. Liang, Q. Hu, F. Ma, Z. Li, Y. Wang, L. Wang, and S. Zhang, “Cu@ Ag nanoparticles doped micron-sized Ag plates for conductive adhesive with enhanced conductivity”, International Journal of Adhesion and Adhesives, 2020, p.102657.

 [7] Banhart J, Ebert H, Kuentzler R,et al. Electronic properties of single-phased metastable Ag-Cu alloys.  Phys. Rev. 1992; B46:9968-9975.

[8] S. Tardieu, D. Mesguich, A. Lonjon, F. Lecouturier-Dupouy, N. Ferreira, G. Chevallier, A. Proietti, C. Estournès, and C. Laurent, “High Strength-High Conductivity Silver Nanowire-Copper Composite Wires by Spark Plasma Sintering and Wire-Drawing for Non-Destructive Pulsed Fields”, IEEE Transactions on Applied Superconductivity, Vol. 30(4), 2020, pp.1-4.

 [9] P.R. Subramanian, J.H. Perepezko, “The Ag-Cu (Silver-Copper) System” J. Phase Equilib., Vol. 14, 1993, pp. 62-75.

[10] K.I. Chen, J.H. Lin, C.P. Ju, “Microstructure and Segregation Behavior of Palladium in Silver-Copper-Palladium Alloys”, J. Dent. Res., Vol. 75, 1996, pp. 1497-1502.

[11] D. Mareci, D. Sutiman, A. Cailean , et al., “Comprative corrosion study of Ag-Pd and Co-Cr alloys used in dental application”, B. Mater. Sci., Vol. 33, 2010, pp 491-500.

[12] S.P. Dimitrijević, B.D. Vurdelja, S.B. Dimitrijević, F.M. Veljković, Z.J. Kamberović, and S.R. Veličković, “Complementary methods for characterization of the corrosion products on the surface of Ag60Cu26Zn14 and Ag58. 5Cu31. 5Pd10 brazing alloys”, Corrosion Reviews, Vol. 38(2), 2020, pp. 111-125.

 [13] R.K. Choudhary, A. Laik, P. Mishra, “Microstructure evaluation during stainless-steel copper vacuum brazing with a Ag-Cu-Pd filler alloy: effect of nickel plating”, J. Mater. Eng. Perform., Vol. 26, 2017, pp. 1085-1100.

[14] M.M. Mcdonald, D.L. Keller,C.R. Heiple, et al., “wettability of brazing filler metals on molybdenum and TZM”, Weld. Res., 1989, pp. 389-395.

[15] H.J. Seol, D.H. Lee, H.K. Lee, et al., “Age-hardening and related phase transformation in an experimental Ag–Cu–Pd–Au alloy”, J. Alloys compd., 2006;407:182-187.

[16] Chin HY, Park MG, Kwon YH, et al. Phase transformation and microstructural changes during ageing process of an Ag–Pd–Cu–Au alloy alloy. J. Alloy. compd., Vol. 460, 2008, pp. 331-336.

[17] H.J. Seol, T. Shiraishi, Y. Tanaka, et al. “Effects of Zn addition to AuCu on age-hardening behaviors at intraoral temperature”, J. Mater. Sci-Mater. M., Vol. 13, 2013, pp. 237-241.

[18] D. Gheorghe, I. Pencea, I.V. Antoniac, and R.N. Turcu, “Investigation of the Microstructure, Hardness and Corrosion Resistance of a New 58Ag24Pd11Cu2Au2Zn1.5In1.5Sn Dental Alloy Materials, Vol 12(24), 2019, pp. 4199-4112.

 [19] G.W. Marshall, S.J. Marshall, K. Szurgot, et al., “Properties of Ag-Cu-Pd dispersed Phase amalgams: microstructures” J. Dent. Res., Vol. 61, 1982, pp. 802-806.

[20] H.J. Seol, T. Shiraishi, Y. Tanaka, et al. “Ordering behaviors and age-hardening in experimental AuCu–Zn pseudobinary alloys for dental applications”, Biomaterials, Vol. 23, 2002, pp. 4873-4879.

[21] H. Winn, Y. Tanaka, T. Shiraishi, et al. “Coherent phase diagram of Au–Cu–Pd ternary system near and within the two-phase region of Au Cu and AuCu I ordered phases”, J. Alloys compd., Vol. 308, 2000, pp. 269-274.

[22] H.K. Lee, H.M. Moon, H.J. Seol, et al., “Age hardening by dendrite growth in a low-gold dental casting alloy”, Biomaterials, Vol. 25, 2004, pp. 3869-3875.

[23] R.G. Davies, N.S. Stoloff, “Order and domain Hardening in Cu₃Au type superlattice alloys”, Acta Metall. Vol. 11, 1963, pp. 1347-1353.

[24] K. Yasuda, H. Metahi, Y. Kanzawa, “Structure and morphology of an age-hardened gold-copper-silver dental alloy”, J. Less-Com Met., Vol. 60, 1978, pp. 65-78.

[25] M.N. Samani, A. Shokuhfar, A.R. Kamali, M. Hadi, “Production of a nanocrystalline Ni₃Al-based alloy using mechanical alloying”, Vol. 500 (1), 2010, pp. 30-33

[26] K. Yasuda, “Age-hardening characteristics of a commercial Dental Gold alloys”, J. Less-Com Met., Vol. 70, 1980, pp. 75-87.

[27] M. Nakagawa, K. Yasuda, “Age-hardening and the associated phase transformation in an Au-55.2at% Cu-17.4at% Ag ternary alloy”, J. Mater. Sci., Vol. 23, 1988, pp. 2975-2982.