Investigation of Springback Angle in Single Point Incremental Forming Process on Explosive Welded Cu/St/Cu Multilaye
Subject Areas :Mohammad Honarpisheh 1 , Mohammad Reza Ebrahimi 2 , Hadi Mansouri 3
1 - Faculty of Mechanical Engineering, University of Kashan, Kashan, Iran
2 - Faculty of Engineering, Jasb branch, Islamic Azad University
3 - Faculty of Mechanical Engineering, University of Kashan, Kashan, Iran
Keywords: Optimization, Spring Back, Taguchi Method, Incremental Sheet Forming,
Abstract :
Nowadays, the role of light weight materials has grown up in important industries such as aerospace and biomechanics, but before the appliance, their strength should be increased. A modern way to increase this factor along with the lightweight factoris using bimetal sheets, hence, the design of multilayer sheets has been very much considered recently. In this study, explosive welded Cu/St/Cu multilayer sheets were used in the incremental forming process to determine the springback phenomenon on different layers. The results indicated that rotational speed, feeding rate, and vertical step parameters can affect spring back in single point incremental forming process (SPIF).Three levels of vertical step size, tool rotational speed, and feed rate have been considered as the input process parameters and spring back as the output.In order to design a better experiment and analyze the data, the Taguchi method was selected on the basis of DOEin Mini-Tab software andthe results have been analyzed by two states. In the first state,the value which was closest to the nominal value is considered to be the optimal result which obtained for spring back angles with parameters of 0.75 mm for the vertical step down, 200 rpm for the rotational speed and 500 and 1000 mm/min for the feeding rate. In the second state, the least amount is considered as the optimal result in which the values of 0.5 and 1 mm of the vertical step down, 150 and 100 rpm of the rotational speed, and 1500 and 500 mm/min of the feeding rate formed the optimal outcome.
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