Age-Hardening Behavior and the Related Changes in a Silver-Copper-Palladium Alloy

Subject Areas : Non-Ferrous H.T.

Morteza Hadi ¹ , Iman Ebrahimzadeh ² , Omid Bayat ³

1 - Metallurgy and Materials Engineering Department, Golpayegan University of Technology, Golpayegan, Iran
2 - Advanced Materials Research Center, Department of Materials Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran
3 - Department of Materials science and Engineering, Hamedan University of Technology, Hamedan, Iran

Received: 2019-10-17 Accepted : 2019-12-15 Published : 2020-05-01

Keywords: X-ray diffraction, Scanning Electron Microscopy, Age-hardening, Ag-Cu-Pd alloys,

Abstract :

Age-hardening behavior and related changes were studied to elucidate the hardening mechanism of an Ag–Cu–Pd alloyby Differential Scanning Calorimetry (DSC), hardness test, X-ray diffraction (XRD), scanning electron microscopic (SEM) observations and energy dispersive spectrometer (EDS). The results showed that hardness of the alloy was raised to 90% and 68% of its solution state value by isothermal aging at 300 ◦C and 400 ◦C, respectively. However, aging at 500 ◦C led to a decrease in the hardness of the alloy. Moreover, while age hardening at 300◦C occurred due to coherency strains between the (111) plane of Ag-rich and the (111) plane of Cu3Pd phases, the mechanism of aging at 400◦C was the formation ofCu3Pd superlattice with the L12-type crystal structure. In contrast, reduction of Cu3Pd phase and formation of Cu solid solution decreased hardness during aging at 500oC.

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