An Investigation on the Modeling of Heat Distribution and Atomic Diffusion in the Joining of the AA2024-T4 to AA6061-T6 by TLP Process

Subject Areas : Journal of Environmental Friendly Materials

Anbarzadeh A ¹ , Sabet H ² , Geranmayeh A. R ³

1 - Department of Materials Engineering, South Tehran Branch, Islamic Azad University, Tehran, Iran
2 - Department of Materials Engineering, Karaj Branch, Islamic Azad University, Karaj, Iran
3 - Department of Materials Engineering, South Tehran Branch, Islamic Azad University, Tehran, Iran

Received: 2020-06-19 Accepted : 2020-10-23 Published : 2020-12-01

Keywords:

Abstract :

The simulation of heat distribution has long been applied for estimating optimal time for heat treatment process in an attempt to optimize the energy consumption. Aluminum alloys have been used to achieve appropriate strength-to-weight ratio and reduce the fuel consumption. In the present research, heat distribution modeling was performed for joining AA2024-T4 to AA6061-T6 in the TLP process utilizing MATALAB R2016b. For this purpose, thermal properties and density of the base alloys and the clamp were extracted from respective ASM standards and applied in the coding. Finally, 1D, and 2D simulations were run to simulate the heat distribution over the base metal at the process temperature. Moreover, the time required to have the copper diffused into the interlayer was estimated through the simulations. The diffusion depth of the Sn into the base metal (Al) was further modeled at different points in time. A Sn-2.5Bi interlayer with two different thicknesses (50 and 70 microns) was also evaluated through actual experiments.

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