مروری بر نانوکامپوزیت‌های پلیمری با هدایت حرارتی بالا و کاربردهای آن
محورهای موضوعی : کاربرد نانوساختارها
مجید میرزایی
1
*
,
مجید رضایی آبادچی
2
,
علیمراد رشیدی
3
1 - گروه پژوهشی مواد غیرفلزی، پژوهشگاه نیرو، تهران، ایران.
2 - گروه پژوهشی مواد غیرفلزی، پژوهشگاه نیرو، تهران، ایران
3 - گروه پژوهشی مواد غیرفلزی، پژوهشگاه نیرو، تهران، ایران.
کلید واژه: نانوکامپوزیت, پلیمر, هدایت حرارتی, پرکننده.,
چکیده مقاله :
در حال حاضر، انباشت و تخلیه سریع حرارت در تجهیزات الکترونیکی و بخش‌های مرتبط از عوامل اصلی محدودکننده کوچک‌سازی و افزایش توان این تجهیزات محسوب می‌شود. این موضوع به طور قابل توجهی عملکرد و طول عمر دستگاه‌های الکترونیکی را تحت تأثیر قرار می‌دهد. بنابراین، بهبود هدایت حرارتی کامپوزیت‌های پلیمری رسانای حرارتی (TCPCs)راه حل اصلی این مشکل است. بر خلاف تولید کامپوزیت‌های پلیمری با هدایت حرارتی ذاتی، پر کردن زمینه پلیمری با مواد پرکننده دارای هدایت حرارتی می‌تواند به طور موثرتری هدایت حرارتی کامپوزیت‌ها را افزایش دهد. این مقاله با بررسی مکانیزم هدایت حرارتی آغاز می‌شود و به تشریح عواملی می‌پردازد که بر هدایت حرارتی کامپوزیت‌های پلیمری اثرگذار هستند، از جمله نوع و ریخت شناسی پرکننده، نحوه توزیع و عاملدار کردن پرکننده‌ها. سپس به معرفی روش‌های مختلف تهیه کامپوزیت‌های پلیمری با پرکننده‌های متنوع پرداخته می‌شود. در نهایت، کاربردهای آن شرح داده شده و چالش‌ها و آینده TCPCs بررسی می‌شود.
چکیده انگلیسی:
The rapid accumulation and dissipation of heat in electronic equipment and related sectors are among the main limiting factors for miniaturization and power enhancement of these devices. This significantly affects the performance and lifespan of electronic devices. Therefore, improving the thermal conductivity of polymer composites (TCPCs)is the primary solution to this problem. Unlike producing polymer composites with inherent thermal conductivity, filling the polymer matrix with thermally conductive fillers can more effectively enhance the thermal conductivity of the composites. This article begins by reviewing the mechanism of thermal conductivity and describes the factors that influence the thermal conductivity of polymer composites, including the type and morphology of the filler, the distribution method, and the functionalization of the fillers. Finally, the applications are described, and the challenges and future of TCPCs are reviewed.
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