Effect of Bonding Time on Microstructure and Mechanical Properties of Transient Liquid Phase Bonding Between WC-Co/St52
محورهای موضوعی :
Hamed Zeidabadinejad
1
(Advanced Materials Research Center, Department of Materials Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran.)
Mahdi Rafiei
2
(Department of Materials Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran.)
Iman Ebrahimzadeh
3
(Advanced Materials Research Center, Department of Materials Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran.)
Mahdi Omidi
4
(Advanced Materials Research Center, Department of Materials Engineering, Najafabad Branch, Islamic Azad University, Najafabad, Iran.)
Farid Naeimi
5
(Department of Materials Engineering, Najafabad Branch, Islamic Azad University, Najafabad 85141-43131, Iran)
کلید واژه: Transient liquid phase bonding, St52 steel, WC-Co compound, microstructure, mechanical properties,
چکیده مقاله :
WC-Co and St52 were joined using the TLP method. The joining process was carried out at 1050 °C for different times using a BNi-2 interlayer. After the joining process, the microstructure of the bonded samples was examined using a scanning electron microscope equipped with energy-dispersive X-ray spectroscopy. X-ray diffraction analysis was also used to investigate the effects of bonding parameters on the phase transformations of the bonding region. The results of the investigations showed that in the isothermal solidification zone, the Ni-base solid solution phase was observed in all samples. Also, the η phase (Co6W6C) was formed in the diffusion affected zone of the WC-Co base material. The size of the produced zones in the bonding region depended on the time of the bonding process, and with the change in the bonding time, the size of these zones also changed. The hardness profile for all samples had the same trend and the maximum hardness was related to WC-Co base material (around 1100 HV) and the hardness in the isothermal solidification zone was about 380 HV. The maximum shear strength was related to the bonded sample at 30 min, about 320 MPa, which was due to the removal and damping of residual stresses by the isothermal solidification zone. The mode of failure in all samples was brittle-ductile.
WC-Co and St52 were joined using the TLP method. The joining process was carried out at 1050 °C for different times using a BNi-2 interlayer. After the joining process, the microstructure of the bonded samples was examined using a scanning electron microscope equipped with energy-dispersive X-ray spectroscopy. X-ray diffraction analysis was also used to investigate the effects of bonding parameters on the phase transformations of the bonding region. The results of the investigations showed that in the isothermal solidification zone, the Ni-base solid solution phase was observed in all samples. Also, the η phase (Co6W6C) was formed in the diffusion affected zone of the WC-Co base material. The size of the produced zones in the bonding region depended on the time of the bonding process, and with the change in the bonding time, the size of these zones also changed. The hardness profile for all samples had the same trend and the maximum hardness was related to WC-Co base material (around 1100 HV) and the hardness in the isothermal solidification zone was about 380 HV. The maximum shear strength was related to the bonded sample at 30 min, about 320 MPa, which was due to the removal and damping of residual stresses by the isothermal solidification zone. The mode of failure in all samples was brittle-ductile.
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