تاثیردما و زمان اتصال دهی بر ریزساختار سیستم GTD-111/BNi-3/GTD-111 به روش فاز مایع گذرا(TLP)
محورهای موضوعی : فصلنامه علمی - پژوهشی مواد نوین
سید عبدالکریم سجادی
1
(استاد گروه مهندسی مواد و متالورژی دانشگاه فردوسی مشهد)
جواد اسدی
2
(گروه مهندسی و علم مواد، مهندسی، فردوسی مشهد، مشهد ایران)
حمید امیدوار
3
(دانشکده مهندسی معدن و متالورژی، دانشگاه صنعتی امیرکبیر، تهران، ایران)
کلید واژه: انجماد همدما, سوپرآلیاژ پایه نیکل, TLP, GTD111,
چکیده مقاله :
در این مقاله تاثیر دما و زمان اتصالدهی بر ریزساختار اتصال فاز مایع گذرای سوپرآلیاژ پایه نیکل GTD-111 مورد مطالعه و بررسی قرار گرفته است. فرایند اتصالدهی در دماهای1080، 1120 و °C1160 در زمانهای مختلف انجام گردید و ریزساختار نواحی مختلف اتصال توسط میکروسکوپ نوری و الکترونی روبشی مورد بررسی و تحلیل قرار گرفت. نتایج نشان داد که با افزایش دمای اتصالدهی از 1080 تا °C1160، زمان انجماد کامل همدما از 195 تا 90 دقیقه کاهش و مقدار انحلال فلز پایه و پهنای درز اتصال افزایش یافته است. همچنین در همه زمانهای نگهداری، ناحیهی اتصال حاوی فازهای ثانویه شامل بوریدهای غنی از نیکل و کروم و سیلیسید نیکل در یک زمینهی g بود. این فازها در قسمتهای مرکزی و مجاور فصلمشترک فلز پایه - اتصال مشاهده شد. مشخص شد که با افزایش زمان اتصالدهی تا انجماد کامل همدما، کسر حجمی ذرات رسوبی ناحیهی اتصال کاهش یافته و اجزای بوریدی ترد بهطور کامل حذف شدهاند. لازم به ذکر است، این فرایند ناشی از وابستگی شدید رفتار سینتیک نفوذی این نوع اتصالات به دما و زمان میباشد. علاوه بر این، مشاهده شد، با افزایش دمای اتصالدهی وسعت ناحیهی اتصال و میزان انحلال فلز پایه افزایش مییابد. همچنین نتایج نشان داد که با افزایش زمان نگهداری در هر سه دمای اتصالدهی تا زمان تکمیل انجماد همدمای کامل، ضخامت منطقهی ASZ و کسر حجمی رسوبات در ناحیهی اتصال کاهش و طول ناحیهی DAZ افزایش مییابد. با توجه به اینکه دمای بحرانی در آلیاژ مورد مطالعه °C1180 میباشد، جهت یکنواختی و همگنسازی ریزساختار اتصالات در شرایط مختلف، عملیات حرارتی بعد از اتصالدهی در دمای °C 1200 و زمان 300 دقیقه انجام گردید که در نتیجهی آن، منطقه متاثر از نفوذ حذف و ریزساختار کاملاً همگن و عاری از رسوبات بوریدی سوزنی و بلوکی تشکیل شد.
In this paper, the effect of bonding temperature and time on the microstructure of transient liquid phase bonding of GTD-111 nickel-based superalloy was studied. The bonding process was performed at temperatures of 1080, 1120 and 1160 °C at different times and the microstructure of the various bonding regions was analyzed by light and scanning electron microscopy. The results show that by increasing the bonding temperature from 1080 to 1160 °C, solidification time was reduced from 195 to 90 min and the dissolution rate of the base metal and the bonding width increased. Also, at all holding times, the bonding zone containing secondary phases included nickel-rich and chromium-rich borides and nickel silicide in a matrix. These phases were observed in the centerline and adjacent of the interface. By increasing the bonding time, the volume fraction of the precipitates in the bonding zone decreased and the brittle boride phases were completely removed. This process is due to the strong dependence of the diffusional behavior of the TLP-joint on temperature and time. It was observed that with increasing the bonding temperature, the bonding width and the rate of dissolution of the base metal increase. The results showed that with increasing holding time at all three bonding temperatures, the thickness of the ASZ zone and the volume fraction of precipitates in the bonding area decreased and the DAZ width increased.
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